Semiconductor device having junctionless vertical gate transistor and method of manufacturing the same

ABSTRACT

A junctionless vertical gate transistor includes an active pillar vertically protruding from a substrate and including a first impurity region, a second impurity region and a third impurity region sequentially formed over the first impurity region; gate electrodes coupled to sidewalls of the second impurity region; and bit lines arranged in a direction of intersecting with the gate electrodes and each contacting the first impurity region. The first to the third impurity regions include impurities of the same polarity.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit under 35 U.S.C. §119 of KoreanPatent Application No. 10-2012-0024991, filed on Mar. 12, 2012 in theKorean Intellectual Property Office, the entirety of which disclosure isincorporated herein by reference.

BACKGROUND

1. Technical Field

The present invention relates to semiconductor devices, and moreparticularly, to a semiconductor device having a junctionless verticalgate transistor and a method of manufacturing the same.

2. Description of the Related Art

The design rule margin has been decreased with an increase in the degreeof integration of semiconductor devices. Such decrease in design rulemargin results in limitations on the technical development of highdensity semiconductor devices.

In recent years, studies have been focused on development of a 4F²layout (F; minimum pattern size obtainable under a given processcondition), which permit formation of cells with a remarkably higherdensity. Particularly, vertical channel transistors where a source and adrain are formed in 1F² have been studied.

However, as a channel region is reduced to 30 nm or less, it becomesmore difficult to improve the degree of integration due to a processdifficulty and an increase in leakage current resulting from a sizereduction of semiconductor devices.

For example, Korean Patent No. 0784930, herein incorporated byreference, discloses a memory cell having a vertical channel double gatestructure, which has an active region of an NPN junction structure.

BRIEF SUMMARY

The present invention provides a semiconductor device that can solve theproblem of current leakage caused by implanting different kinds ofimpurities into source, drain and body regions.

In addition, the present invention provides a method of manufacturing asemiconductor device that can solve complexity and difficulty ofimpurity implantation.

In accordance with one aspect of the present invention, a semiconductordevice includes: an active pillar vertically protruding from a substrateand including a first impurity region, a second impurity region and athird impurity region from a lower side thereof; gate electrodes formedon sidewalls of the second impurity region; and bit lines arranged in adirection of intersecting with the gate electrodes and each contactingthe first impurity region, wherein the first to third impurity regionsinclude impurities of the same conductivity.

In accordance with another aspect of the present invention, a method ofmanufacturing a semiconductor device includes forming a plurality ofactive pillars, each having a first impurity region formed on asubstrate and second and third impurity regions sequentially formed onthe first impurity region; forming a bit line between adjacent activepillars on the substrate to be electrically disconnected from thesubstrate while contacting one side surface of the first impurityregion; and forming gate electrodes on sidewalls of the second impurityregion in a direction of intersecting with the bit line.

In accordance with a further aspect of the present invention, a methodof manufacturing a semiconductor device includes forming a plurality ofbit lines embedded within a substrate; forming active pillars on the bitlines, each of the active pillars including a first impurity regioncontacting the bit line and second and third impurity regionssequentially formed on the first impurity region; and forming gateelectrodes on sidewalls of the second impurity region in a direction ofintersecting with the bit lines.

According to the present invention, the semiconductor device employs ajunctionless vertical gate transistor, which is formed by implantationof an impurity into source, drain and body regions in the sameconcentration and is free from junction current leakage, therebyproviding excellent electrical properties and reliability and enablinghigh integration of devices through formation of a cell structure of4F².

In addition, since the semiconductor device according to the presentinvention has no difference in doping concentration between the sourceand the body and between the drain and the body, the intensity ofelectrical field becomes weaker in junctions between the source and thebody and between the drain and the body than in the case of using theexisting junction transistors, so that the semiconductor device is lessaffected by impact ionization or gate induced drain leakage (GIDL).

Further, according to the present invention, the semiconductor deviceemploys the junctionless vertical gate transistor and thus does notsuffer from a floating body effect, which causes an increase in voltageof the body due to holes generated during operation of the device,despite the absence of body contact.

According to the present invention, the method of manufacturing asemiconductor device may solve complexity and difficulty of impurityimplantation by implanting the same kind of impurity into source, drainand body regions, thereby improving productivity and yield.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the inventionwill become apparent from the detailed description of the followingembodiments in conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view of part of a semiconductor device having ajunctionless vertical gate transistor in accordance with a firstembodiment of the present invention;

FIG. 2 is a plan view of the semiconductor device of FIG. 1;

FIG. 3 is a cross-sectional view taken along the line A-A′ of FIG. 2;

FIG. 4 is a cross-sectional view taken along the line B-B′ of FIG. 2;

FIG. 5 is a graph depicting a relation between a gate-voltage and adrain-current depending on a doping concentration of impurities in anactive region of a DRAM having a junctionless vertical gate transistoraccording to the first embodiment of the present invention;

FIG. 6 is a graph depicting a relation between a gate-voltage and adrain-current depending on a silicon thickness of an active region of aDRAM having a junctionless vertical gate transistor according to thefirst embodiment of the present invention;

FIG. 7 is a perspective view of part of a semiconductor device having ajunctionless vertical gate transistor in accordance with a secondembodiment of the present invention;

FIG. 8 is a graph depicting a relation between a gate-voltage and adrain-current depending on a thickness of a gate insulation layer of aDRAM having a junctionless vertical gate transistor according to thefirst embodiment of the present invention;

FIG. 9 is a graph depicting a relation between a drain-voltage and adrain-current depending on a gate voltage applied to an active region ofa DRAM having a junctionless vertical gate transistor according to thefirst embodiment of the present invention;

FIG. 10 is a graph depicting a relation between drain-voltage and adrain-current depending on a silicon thickness of an active region of aDRAM having a junctionless vertical gate transistor according to thefirst embodiment of the present invention;

FIG. 11 is a sectional view of part of a semiconductor device having ajunctionless vertical gate transistor in accordance with a thirdembodiment of the present invention;

FIGS. 12, 15, 18, 21, 24, 27 and 30 are plan views of a method ofmanufacturing a semiconductor device in accordance with an embodiment ofthe present invention;

FIGS. 13, 16, 19, 22, 25, 28 and 31 are cross-sectional views takenalong the lines A-A′ of FIGS. 12, 15, 18, 21, 24, 27 and 30,respectively;

FIGS. 14, 17, 20, 23, 26, 29 and 32 are cross-sectional views takenalong the lines B-B′ of FIGS. 12, 15, 18, 21, 24, 27 and 30,respectively;

FIG. 33 is a sectional view of the semiconductor device of FIG. 31,which has a storage node contact plug and a capacitor formed in anactive region;

FIGS. 34 and 35 are sectional views of a method of manufacturing asemiconductor device via impurity implantation according to anotherembodiment of the present invention;

FIGS. 36 and 37 are sectional views of a method of manufacturing asemiconductor device via impurity implantation according to a furtherembodiment of the present invention;

FIG. 38 is a graph depicting voltage-current characteristics of a DRAMaccording to an embodiment of the present invention;

FIG. 39 is a graph depicting charge and discharge characteristics of aDRAM according to an embodiment of the present invention; and

FIG. 40 is a graph depicting (i) an energy band of a DRAM according toan embodiment of the present invention and (ii) an energy band of aconventional DRAM including source/drain regions formed throughimplantation using heterogeneous impurities.

DETAILED DESCRIPTION

Embodiments of the invention will now be described in detail withreference to the accompanying drawings. It should be understood that thepresent invention is not limited to the following embodiments and may beembodied in different ways, and that the embodiments are given toprovide complete disclosure of the invention and to provide thoroughunderstanding of the invention to those skilled in the art. The scope ofthe invention is limited only by the accompanying claims and equivalentsthereof. Like components will be denoted by like reference numeralsthroughout the specification.

FIG. 1 is a perspective view of part of a semiconductor device having ajunctionless vertical gate transistor in accordance with a firstembodiment of the present invention; FIG. 2 is a plan view of thesemiconductor device of FIG. 1; FIG. 3 is a cross-sectional view takenalong the line A-A′ of FIG. 2; FIG. 4 is a cross-sectional view takenalong the line B-B′ of FIG. 2; FIG. 7 is a perspective view of part of asemiconductor device having a junctionless vertical gate transistor inaccordance with a second embodiment of the present invention; and FIG.11 is a sectional view of part of a semiconductor device having ajunctionless vertical gate transistor in accordance with a furtherembodiment of the present invention. By way of example, a dynamic randomaccess memory (DRAM) is shown in the drawings.

Referring to FIG. 1 to FIG. 4, a semiconductor device 100 according toone embodiment of the present invention includes a plurality of activepillars 120, each of which vertically protrudes from a substrate 110 andincludes a first impurity region 120 a, a second impurity region 120 b,and a third impurity region 120 c formed from a lower side thereof. Apair of gate electrodes 160 is formed over first and second sidewalls ofeach of the second impurity regions 120 b. Bit lines 130 are arranged ina cross direction to the gate electrodes 160 and are formed over asidewall of the first impurity region 120 a. The first, the second andthe third impurity regions 120 a, 120 b, 120 c include impurities of thesame polarity and have substantially the same concentration.

First, referring to FIG. 1 to FIG. 4, a junctionless vertical gatetransistor used for the semiconductor device 100 according to a firstembodiment of the present invention will be described.

The junctionless vertical gate transistor according to an embodiment ofthe present invention includes (i) the plurality of active pillars 120,each of which vertically protrudes from the substrate 110 and includesthe first, second, and third impurity regions 120 a, 120 b, 120 csequentially formed from a lower side thereof, and (ii) the gateelectrodes 160 formed over the first and the second sidewalls of thesecond impurity region 120 b.

The substrate 110 may be composed of a silicon (Si) substrate, a silicongermanium (SiGe) substrate, a germanium (Ge) substrate, a III-V groupcompound semiconductor substrate, and the like, and may include a nanostructure such as nano wires or nano ribbons.

The active pillars 120 vertically protrude from a surface of thesubstrate 110 and are composed of, for example, silicon. The activepillars 120 may be integrally formed with the substrate 110.Alternatively, the active pillars 120 may be formed using a separatesemiconductor substrate or a separate epitaxial semiconductor layergrown from the substrate 110. The active pillars 120 correspond to partsof the semiconductor device in which trenches (not shown) are notformed. The respective active pillars 120 are separated from each otherby a first isolation layer 125, a second isolation layer 140, and athird isolation layer 170 formed in the trenches (not shown).

Each of the active pillars 120 includes the first impurity region 120 a,the second impurity region 120 b, and the third impurity region 120 c,which are sequentially formed from a lower side of each of the activepillar 120. Here, the first impurity region 120 a is separated by apredetermined distance from the third impurity region 120 c over thesubstrate 110 in the vertical direction, and the second impurity region120 b is interposed between the first impurity region 120 a and thethird impurity region 120 c.

In the present invention, the first impurity region 120 a may correspondto a drain region through which electric charges flow to the bit line130. The second impurity region 120 b may correspond to a body region,or to a channel region through which signals pass between the drainregion and a source region when the gate electrodes 160 are turned on orturned off. The third impurity region 120 c may correspond to the sourceregion which is electrically coupled to a storage node contact plug anda lower electrode of a capacitor.

The first, the second, and the third impurity regions 120 a, 120 b, 120c may include impurities of the same polarity and have substantially thesame concentration. Here, the first, the second, and the third impurityregions 120 a, 120 b, 120 c may have uniform doping profiles. Inaddition, a vertical channel is formed between the first impurity region120 a and the third impurity region 120 c in a direction perpendicularto a surface of the substrate 110.

When the substrate 110 is a silicon substrate, the impurities may beN-type impurities. The N-type impurities may be V-group impurities suchas arsenic (As), phosphorus (P), bismuth (Bi), antimony (Sb), and thelike, which may be used alone or in combination of two or more thereof.

When the substrate 110 is a silicon germanium (SiGe) substrate, agermanium (Ge) substrate, or a III-V group compound semiconductorsubstrate, the impurities may be P-type impurities. The P-typeimpurities may be III-group impurities, such as aluminum (Al), boron(B), indium (In), gallium (Ga), and the like, which may be used alone orin combination of two or more thereof.

FIG. 5 is a graph showing a relation between a gate-voltage and adrain-current depending on a doping concentration of impurities in anactive pillar of a DRAM having the junctionless vertical gate transistoraccording to the first embodiment of the present invention.

In FIG. 5, to obtain a drain-current on/off ratio with respect to agate-voltage, devices were used each of which employs dual-gateelectrodes composed of molybdenum (Mo), and has work function of 5.25eV. In each device, the active pillar 120 had a thickness (Tsi) of 10nm, and a gate insulation layer 150 had a thickness (Tox) of 5 nm. Theimpurities were implanted into the active pillars 120 with dopingconcentrations of 1×10²⁰ atom/cm³, 5×10¹⁹ atom/cm³, 4×10¹⁹ atom/cm³,3×10¹⁹ atom/cm³, 2×10¹⁹ atom/cm³, 1×10¹⁹ atom/cm³, 9×10¹⁸ atom/cm³, and8×10¹⁸ atom/cm³, respectively. Herein, the term “thickness (Tsi)” of theactive pillar is defined as the thickness of a silicon pillar extendingbetween two neighboring gate electrodes.

Referring to FIG. 5, the on/off ratio was high in impurity dopingconcentrations of 2×10¹⁹ atom/cm³, 1×10¹⁹ atom/cm³, 9×10¹⁸ atom/cm³ and8×10¹⁸ atom/cm³. Particularly, the on/off ratio was highest in animpurity doping concentration of 8×10¹⁸ atom/cm³. On the other hand, theon/off ratio was very low in impurity doping concentrations of 1×10²⁰atom/cm³, 5×10¹⁹ atom/cm³, 4×10¹⁹ atom/cm³, and 3×10¹⁹ atom/cm³.

Generally, when using the junctionless vertical gate transistor for asemiconductor device such as DRAM and the like, it is advantageous tohave a high on/off ratio in order to secure sufficient read/writeoperation. In particular, in order to use the junctionless vertical gatetransistor according to an embodiment of the present invention for asemiconductor device such as DRAM and the like, it is preferable thatthe doping concentration of impurities in the active pillar 120 mayrange from 8×10¹⁸ atom/cm³ to 3×10¹⁹ atom/cm³ so as to provide asufficient on/off ratio while maintaining sufficient on-current. If thedoping concentration of impurities in the active pillar 120 is less than8×10¹⁸ atom/cm³, a threshold voltage can be increased with an increasein resistance of the source and the drain regions, making it difficultto obtain rapid operation of the semiconductor device. On the contrary,if the doping concentration of impurities in the active pillar 120exceeds 3×10¹⁹ atom/cm³, it is difficult to obtain a sufficientdifference between on-current and off-current for operation of thedevice.

FIG. 6 is a graph depicting a relation between a gate-voltage and adrain-current depending on a silicon thickness of an active pillar of aDRAM employing the junctionless vertical gate transistor according tothe first embodiment of the present invention.

In FIG. 6, to obtain a drain-current on/off ratio with respect to agate-voltage, devices were used each of which employs a dual-gateelectrode composed of molybdenum (Mo) and has work functions of 5.25 eV.In each device, the gate insulation layer had a thickness (Tox) of 5 nmand the doping concentrations of impurities in the active pillar was1×10¹⁹ atom/cm³, The active pillars have thicknesses (Tsi) of 5 nm, 10nm, 20 nm, 30 nm, 40 nm and 50 nm, respectively.

Referring to FIG. 6, the on/off ratio decreased with increasingthickness (Tsi) of the active pillar. In particular, when the activepillar had a thickness (Tsi) of 20 nm or less, it was possible to obtaina sufficient on/off ratio through the gate electrodes. However, when theactive region had a thickness (Tsi) exceeding 20 nm, a sufficient on/offratio through the gate electrodes was not obtained

Thus, according to the present invention, a thickness of the activepillar, that is, a distance between two neighboring gate electrodes maybe in the range from 10 nm to 20 nm in order to provide a sufficienton/off ratio through the gate electrodes 160 with the dopingconcentration within the aforementioned range in use for a semiconductordevice such as DRAM and the like. If a thickness of the active pillar120 is less than 10 nm, it is difficult to form such a thin activepillar, and if a thickness of the active pillar 120 exceeds 20 nm, asufficient on/off ratio through the gate electrodes cannot be obtained.

For process convenience, the gate electrodes 160 may be formed overfirst and second sidewalls of the active pillar 120 to be disposed overthe second impurity region 120 b to form a linear type dual-gate. Thesecond sidewall is disposed opposite to the first sidewall. Here, sincethe gate electrodes 160 are arranged in a direction perpendicular to thesurface of the substrate 110, the gate electrodes 160 can be referred toas vertical gates.

The gate electrodes 160 may be formed of electrically conductivematerials, for example, a metallic material having substantially thesame work function (about 5.25 eV) as that of p⁺-doped polysilicon. Insome embodiments, the gate electrodes 160 may be formed of molybdenum(Mo), nickel (Ni), platinum (Pt), ruthenium oxide (RuO₂), or the like.Although not shown in the drawings, each of the gate electrodes 160extends in one direction to form a word line.

Meanwhile, in a second embodiment as shown in FIG. 7, the gate electrode160 may be formed over one sidewall of the active pillar 120, ratherthan being formed over both of the first and the second sidewalls. Thegate insulation layer 150 may be interposed between the gate electrode160 and the second impurity region 120 b of the active pillar 120. As inthe case of forming the dual-gate 160, it is possible to obtain a highon/off ratio.

In addition, although not shown in the drawings, the gate electrodes maybe formed as surrounding gates, which partially or completely surroundthe sidewalls of the active pillar 120 in the second impurity region,thereby providing a higher on/off ratio than the dual-gate.

Referring to FIG. 1 to FIG. 4, the gate insulation layer 150 isinterposed between the active pillar 120 in the second impurity region120 b and the gate electrode 160. For example, the gate insulation layer150 may be composed of a silicon oxide (SiO₂) layer or a dielectric(high-k) layer which has a higher dielectric constant than the siliconoxide (SiO₂) layer.

The gate insulation layer 150 may include a vertical insulation section150 a formed over a sidewall of the active pillar 120 in the secondimpurity region 120 b and a horizontal insulation section 150 bextending from a lower portion of the vertical insulation section 150 ato over a surface of the first impurity region 120 a between the secondimpurity regions 120 b. The gate insulation layer 150 may be formed onone sidewall of the second impurity region 120 b or may be formed toextend to a sidewall of the third impurity region 120 c so long as itcan be formed between the gate electrodes 160 and the second impurityregion 120 b.

FIG. 8 is a graph depicting a relation between a gate-voltage to adrain-current according to a thickness of a gate insulation layer of aDRAM having a junctionless vertical gate transistor as shown in FIG. 1.Here, not only in FIG. 8 but also throughout the specification, athickness of the gate insulation layer is defined as a distance betweenthe second impurity region and the gate electrode.

In FIG. 8, a drain-current on/off ratio with respect to a gate-voltageapplied via dual-gate electrodes was detected using the device accordingto the first embodiment of the present invention which employs adual-gate electrode. The dual-gate electrode is composed of molybdenum(Mo) and has a work function of 5.25 eV. The active pillar had athickness (Tsi) of 10 nm. Experiments were performed with devices withgate insulation layers whose thicknesses (Tox) are 2 nm, 3 nm, 4 nm, 5nm and 7 nm, respectively.

Referring to FIG. 8, the on/off ratio was decreased with increase of athickness of the gate insulation layer (Tox). Particularly, when thegate insulation layer had a thickness (Tox) of 2 nm, a threshold voltagevalue obtained is suitable for operation of the DRAM and sufficient fora proper on/off operation as well.

Thus, according to the present invention, in the gate insulation layer150, the vertical insulation section 150 a may be formed to a thicknessof 3 nm or less, preferably in the range from 1 nm to 3 nm, in order toprovide a sufficient threshold voltage for operation of the device and aproper on/off operation of the gate electrodes 160 under such a dopingconcentration condition in the active pillar 120 as aforementioned.

If the thickness of the vertical insulation section 150 a of the gateinsulation layer 150 is less than 1 nm, short circuit can occur betweenthe gate electrodes 160 and the active region 120. On the contrary, ifthe thickness exceeds 3 nm, it is difficult to obtain a sufficienton/off ratio through the gate electrodes 160 in a given dopingconcentration which is aforementioned, causing a difficulty in operationof the device.

Here, the active region 120, the gate insulation layer 150, and the gateelectrodes 160 constitute a transistor. Since the first to thirdimpurity regions 120 a, 120 b, 120 c of the active region 120 includethe impurities of the same polarity and have substantially the sameconcentration and the gate electrodes 160 are formed perpendicular tothe surface of the substrate 110, such a transistor may be referred toas the junctionless vertical gate transistor.

FIG. 9 is a graph depicting a relationship between a drain-voltage to adrain-current depending on a gate voltage which is obtained using a DRAMhaving the junctionless vertical gate transistor according to the firstembodiment of the present invention employing a dual-gate electrode.FIG. 10 is a graph depicting a relationship between a drain-voltage to adrain-current depending on a silicon thickness of an active pillar of aDRAM having the junctionless vertical gate transistor according to thefirst embodiment of the present invention.

In FIG. 9, a drain-voltage with respect to a drain-current depending ona gate voltage applied via dual-gate electrodes (p⁻ poly gate level)using the first embodiment of the present invention. The dual-gateelectrodes 160 was composed of molybdenum (Mo) and each had workfunctions of 5.25 eV. The active pillar had a thickness (Tsi) of 40 nm,a doping concentration was 1×10¹⁹ atom/cm³, and gate voltages were setto 0.05V, 1V, 2V and 3V, respectively.

Referring to FIG. 9, the relationship between a drain-voltage and adrain-current of the DRAM having the junctionless vertical gatetransistor according to an embodiment of the present invention wasdetected while applying different gate voltages. As shown in FIG. 9, itis confirmed that the DRAM according to an embodiment of the presentinvention is free from kink phenomenon from the fact that the draincurrent keep increasing, rather than being saturated, when the drainvoltage increases.

When a DRAM cell employs a conventional vertical gate transistor,floating body effect should be taken into consideration which is causedby absence of body contact.

However, since the junctionless vertical gate transistor according to anembodiment of the present invention has no junction between the thirdimpurity region 120 c and the second impurity region 120 b, and betweenthe first impurity region 120 a and the second impurity region 120 b(that is, there is no junction either between the source and the bodyand between the drain and the body), the junctionless vertical gatetransistor has a lower electrical barrier between the source and thebody than that of the conventional vertical gate transistor, and allowsholes move to the source, thereby providing various advantages to theDRAM cell, including effective elimination of the floating body effect.

Further, since there is no difference in doping concentration betweenthe third impurity region 120 c and the second impurity region 120 b,and between the first impurity region 120 a and the second impurityregion 120 b (that is, between the source and the body and between thedrain and the body), and an intensity of electric field becomesrelatively weakened in junctions between the third impurity region 120 cand the second impurity region 120 b, and between the first impurityregion 120 a and the second impurity region 120 b (that is, in junctionsbetween the source and the body and between the drain and the body), aneffect resulting from ionization or gate induced drain leakage (GIDL) isinsignificant.

In FIG. 10, a relationship between a concentration of carriers, e.g.,holes and a thickness (Tsi) of the active pillar is detected using adevice employing dual-gate electrodes (p⁺ poly gate level) according tothe first embodiment of the present invention. Each of the dual-gateelectrodes is composed of molybdenum (Mo) and has a work function of5.25 eV. The thickness (Tox) of a gate insulation layer was set to 5 nm,the doping concentration was set to 1×10¹⁹ atom/cm³, and the thickness(Tsi) of the active pillar was set to 5 nm, 10 nm, 20 nm, 30 nm, 40 nm,and 50 nm, respectively.

As can be seen from FIG. 10, even when the thickness (Tsi) of the activepillar was decreased from 50 nm to 10 nm, the carrier concentration inthe body region was not increased.

In the junctionless vertical gate transistor according to an embodimentof the present invention, when the gate electrodes 160 are in anoff-state, that is, Vg≦Vt where Vg is a gate voltage and Vt is athreshold voltage, the channel region is in a depletion state, so thatthe transistor is operated without electric current flowing through thetransistor. On the contrary, when the gate electrodes 160 are in anon-state, that is, Vg≧Vt, the channel region is in an accumulationstate, so that electric current flows through the transistor whenvoltage is applied to the drain. In operation, the DRAM performs writeoperation in the accumulation state of the junctionless vertical gatetransistor, and becomes a stand-by state in the depletion state of thejunctionless vertical gate transistor.

As such, in the junctionless vertical gate transistor according to anembodiment of the present invention, the source, drain and body regionsare doped with impurities and have substantially the same concentration.Thus, the junctionless vertical gate transistor according to anembodiment of the present invention does not suffer from junctioncurrent leakage, and thus exhibits good characteristics for a transistorfor memory device. Thus, high density DRAMs with excellentcharacteristics can be obtained.

The semiconductor device 100 according to an embodiment according to thepresent invention includes the junctionless vertical gate transistorwhich exhibits excellent characteristics for a transistor for memorydevice.

Referring again to FIG. 1 to FIG. 4, the bit line 130 is buried in thefirst insulation layer 125 between adjacent first impurity regions 120 aand contacts at one sidewall with the first impurity region 120 a andarranged cross to a word line (not shown). In other words, the bit line130 is electrically connected to the first impurity region 120 a at theone sidewall.

The bit line 130 is isolated from the word line by a thickness of ahorizontal insulation section 150 b of the gate insulation layer 150.The horizontal insulation section 150 b of the gate insulation layer 150may have a thickness ranging from 50 nm to 100 nm in order to preventshort circuit between the bit line 130 and the word line. If thethickness of the horizontal insulation section 150 b of the gateinsulation layer 150 is less than 50 nm, short circuit can occur betweenthe bit line 130 and the word line, and if the thickness exceeds 100 nm,it is difficult to achieve high integration of the device and channelcharacteristics are deteriorated.

Such bit lines 130 may be formed of an electrically conductive materialhaving low resistance in order to reduce resistance. The bit lines 130may be formed of a metallic material, for example, tungsten (W).Alternatively, the bit lines 130 may be composed of a silicide layer.For example, the silicide layer may include tungsten silicide, titaniumsilicide, cobalt silicide, nickel silicide, and the like. Alternatively,the bit lines 130 may be formed of a polysilicon material.

In the semiconductor device 100, the first isolation layer 125 is formed(i) under the bit lines 130 and (ii) over the substrate exposed betweenthe bit line 130 and the first impurity region 120 a. In addition, thesecond isolation layer 140 is formed over sidewalls of the active pillar120 of above the bit lines 130 and over the first isolation layer 125.Further, the third isolation layer 170 is formed (i) between the gateelectrodes 160 and (ii) between the gate insulation layers 150 above thegate electrodes 160 to prevent short circuit between adjacent gateelectrodes 160. The active pillars 120 are electrically isolated fromeach other by the first to third isolation layers 125, 140, 170, so thatadjacent cells are electrically isolated from each other.

The first, second, and third isolation layers 125, 140, 170 may beformed of a same material or a different materials. The first to thethird isolation layers 125, 140, 170 may be composed of typicalinsulation materials, for example, silicon oxide, silicon nitride,borophosphosilicate glass (BPSG), phosphosilicate glass (PSG),spin-on-glass (SOG), polysilazane (PSZ), tetrahydroxysilane (O₃-TEOS),high density plasma (HDP) oxide, an atomic layer deposition (ALD) oxidelayer, which may be used alone or in combination thereof, without beinglimited thereto.

Meanwhile, in a further embodiment as shown in FIG. 11, the bit lines130 may be buried within the substrate 110 under the first impurityregions 120 a, rather than being disposed at the same level with thefirst impurity regions 120 a. In this case, the bit line 130 is formedover liner insulation layer 172, which is formed along inner sidewallsof a recess formed in the substrate 110. Accordingly, each of the bitlines 130 has an upper side adjoining the first impurity region 120 aand a lower surface and sidewalls surrounded by the liner insulationlayer 172, thereby preventing short circuit with the substrate 110.Here, the bit line 130 may be formed of a conductive material, forexample, metal, metal silicide, polysilicon, and the like.Alternatively, the bit line 130 may be formed by ion implantationperformed into the substrate 110.

A gap between adjacent first impurity regions 120 a is filled with thesecond insulation layer 140. With this configuration, it is advantageousin that short circuit between the word line and the bit line 130 isprevented.

In this embodiment, the semiconductor device 100 employing thejunctionless vertical gate transistor may exhibit improvedcharacteristics of the transistor as a result of elimination of junctioncurrent leakage between the first impurity region 120 a and the secondimpurity region 120 b, and between the third impurity region 120 c andthe second impurity region 120 b, thereby creating a highly integrated4F² cell structure showing excellent electrical properties andreliability.

Meanwhile, although a DRAM is mentioned as an example which mayemploying a junctionless vertical gate transistor according to thepresent invention, the present invention is not limited thereto and canbe applied to other devices other than a DRAM. That is, it should beunderstood that a junctionless vertical gate transistor according to thepresent invention may be applied not only to the DRAM but also to othersemiconductor devices.

Next, a method of manufacturing a semiconductor device using ajunctionless vertical gate transistor according to one embodiment of theinvention will be described.

FIGS. 12, 15, 18, 21, 24, 27 and 30 are plan views of a method ofmanufacturing a semiconductor device in accordance with an embodiment ofthe present invention; FIGS. 13, 16, 19, 22, 25, 28 and 31 arecross-sectional views taken along the line A-A′ of FIGS. 12, 15, 18, 21,24, 27 and 30, respectively; and FIGS. 14, 17, 20, 23, 26, 29 and 32 arecross-sectional views taken along the line B-B′ of FIGS. 12, 15, 18, 21,24, 27 and 30, respectively

Referring to FIG. 12 to FIG. 14, a substrate 110 in an active region isetched in a first direction to form a plurality of pillars P separatedfrom each other by a plurality of first trenches T1 arranged at constantintervals.

The substrate 110 may be composed of silicon (Si) substrate, a silicongermanium (SiGe) substrate, a germanium (Ge) substrate, a III-V groupcompound semiconductor substrate, and the like, and may include a nanostructure such as nano wires or nano ribbons. When the substrate 110 isa silicon substrate, the pillars P may be silicon pillars.

Each of the pillars P vertically protrudes from the substrate 110 wherethe trench T1 is not formed, to provide an active region of atransistor.

Such a pillar P may be formed to a thickness ranging from 10 nm to 20 nmwhich is proper to provide a sufficient on/off ratio. On/off operationis performed using a voltage applied through the gate electrode into theactive region. The active region is doped with impurities.

The first trenches T1 may be formed through typical photolithographytechnology. For example, the first trenches T1 may be formed by coatinga photosensitive material on the substrate 110 to form a photosensitivelayer (not shown), patterning the photosensitive layer using apredesigned mask to form a photosensitive layer pattern (not shown)extending in a first direction, and etching the upper surface of thesubstrate using the photosensitive layer pattern as an etching mask.

However, since the first trench T1 has a high aspect ratio, the upperside of the substrate 110 can be damaged when the substrate 110 issubjected to etching using only the mask. Thus, before forming thephotosensitive layer, a hard mask layer (not shown) including nitride,oxide, SiON, amorphous carbon, or a combination thereof may be formedbetween the substrate 110 and the photosensitive layer.

By way of example, when the substrate 110 is a silicon substrate, thepillars P may be formed by a dry etching process using chlorine (Cl₂)gas, HBr gas, or a mixture of chlorine (Cl₂) gas and HBr gas.

Referring to FIG. 15 to FIG. 17, a first isolation layer 125 is formedover a bottom surface of the first trench Ti (see FIG. 14) and a lowerportion of one sidewall of the first trench T1 (see FIG. 14), and a bitline 130 fills the trench T1 between the first insulation layer 125 andthe pillar P (see FIG. 14).

More specifically, first, an insulation layer (not shown) is formed bydepositing an insulation material along an inner wall of the firsttrench T1 (see FIG. 14). Then, the insulation layer (not shown) issubjected to a selective etching process until one sidewall of thepillar P is exposed, thereby forming the first insulation layer 125 overthe bottom of the first trench T1 (see FIG. 14) and one sidewall of thepillar P at the lower portion of the first trench T1 (see FIG. 14). Theinsulation layer for forming the first isolation layer 125 may be formedby chemical vapor deposition (CVD) or atomic layer deposition (ALD).

Then, a metallic material having low resistance is deposited over thefirst insulation layer 125 using a deposition process such as physicalvapor deposition (PVD), chemical vapor deposition (CVD), metal organicchemical vapor deposition (MOCVD), and the like. As a result, the firsttrench T1 (see FIG. 14) is filled with the metallic material. Then, themetal layer is subjected to a selective etching process until an uppersurface of the first isolation layer 125 is exposed, thereby forming bitlines 130, each of which contacts with a pillar P at one sidewall.

The bit lines 130 may be formed of tungsten silicide, titanium silicide,cobalt silicide, nickel silicide, and the like through an additionalsilicide process.

The first isolation layer 125 is placed to allow each bit line 130 tocontact a lower portion of one sidewall of the pillar P. Such a bit line130 is a buried bit line.

Although the bit line 130 is illustrated as a line type, the bit line130 may have any shape so long as the bit line is formed to contact alower portion of the pillar P at one sidewall. The lower portion of thepillar P will become a first impurity region in a subsequent process.

Referring to FIG. 18 to FIG. 20, an impurity is implanted into theplurality of pillars P (see FIG. 17).

The process of implanting an impurity into the pillars P (see FIG. 17)may be carried out so that the pillar P has a doping concentrationranging from 8×10¹⁸ to 3×10¹⁹ atom/cm³. The process may include multiion implantation, tilt ion implantation, and oriented ion implantation,alone or in combination thereof. The implantation process is performedwhile moving the substrate 110 in front, rear, right or left directions.

Then, both of the second impurity regions 120 b and the third impurityregions 120 c are formed through an in-situ process over the firstimpurity regions 120 a.

Here, ion implantation may be performed while changing ionization energyto allow impurities of the same polarity to be uniformly implanted suchthat the pillars P (see FIG. 17) have substantially the sameconcentration of impurities from lower portion to the top of eachpillar.

When the substrate 110 is a silicon substrate, the ion implantation maybe performed using N-type impurities such as arsenic (As), phosphorus(P), bismuth (Bi), antimony (Sb), and the like. Alternatively, when thesubstrate 110 is a silicon germanium (SiGe) substrate, a germanium (Ge)substrate, or a III-V group compound semiconductor substrate, the ionimplantation may be performed using P-type impurities, such as aluminum(Al), boron (B), indium (In), gallium (Ga), and the like.

As a result, each of the pillars P (see FIG. 17) may form an activepillar 120, which includes the first impurity region 120 a, the secondimpurity region 120 b, and the third impurity region 120 c, which aresequentially formed from the lower part thereof and include impuritiesof the same polarity and have substantially the same concentrationranging from 8×10′⁸ to 3×10¹⁹ atom/cm³.

Although the active pillars 120 are illustrated as including the firstto third impurity regions 120 a 120 b, 120 c formed through impurityimplantation, the first to third impurity regions 120 a, 120 b, 120 c ofthe active pillars 120 may be defined by places where gate electrodesare formed in a subsequent process.

Here, the first impurity region 120 a may correspond to a drain region,which will be electrically connected to the bit line 130. The secondimpurity region 120 b may correspond to a body region or a channelregion interposed between the first impurity region 120 a and the thirdimpurity region 120 c, and the third impurity region 120 c maycorrespond to a source region, which will be electrically connected to astorage node contact plug (or a capacitor lower electrode), which areformed by subsequent processes.

As the first impurity region 120 a is separated by a certain distancefrom the third impurity region 120 c in the vertical direction, avertical channel is formed between the first impurity region 120 a andthe third impurity region 120 c.

The first to the third impurity regions 120 a, 120 b, 120 c are formedby uniformly implanting impurities of the same kind, thereby providing auniform doping profile. In addition, unlike a conventional techniquewhere impurities implanted into the source and drain regions aredifferent from the channel region, the present invention has neitherdoping concentration gradient, nor drastic change in the doping profilebetween the channel and the source and between the channel and the drainregions. In addition, there is no dopant transformation due to theimpurities implanted in the substrate 110 in the active region. Thus,conventional problems related to process complexity and difficulty forimpurity implantation can be solved, thereby improving productivity anda process yield.

Furthermore, since the first, second, and third impurity regions 120 a,120 b, 120 c are formed by implanting the same kind of impurity, thereis no junction interface either between the first impurity region 120 aand the second impurity region 120 b, or between the third impurityregion 120 c and the second impurity region 120 b. Thus, junctioncurrent leakage can be effectively prevented.

Meanwhile, after ion implantation, in order for uniform distribution ofthe implanted impurity within the active region 120, the method mayfurther include annealing at 900 to 1100 Celsius degrees, for example,using rapid thermal annealing (RTA).

Referring to FIG. 21 to FIG. 23, a second isolation layer 140 is formedto fill a gap between the active pillars 120. The second isolation layer140 is formed above the bit lines 130 and the first isolation layer 125.In this case, the second isolation layer 140 is formed over sidewalls ofthe second and third impurity regions 120 b, 120 c.

The second isolation layer 140 may be formed by depositing a siliconoxide layer, a silicon nitride layer, a BPSG layer, a PSG layer, a SOGlayer, a PSZ layer, an O₃-TEOS layer, a HDP oxide layer, an ALD oxidelayer or the like via CVD or ALD to fill a gap which is disposed betweenthe active pillars and above the bit line 130 and the first isolationlayer 125. Then, the second isolation layer 140 may be subject to achemical mechanical polishing (CMP) or an etch-back process until anupper surface of the active region 120 is exposed. In this way, thesecond isolation layer becomes planarization with the upper surface ofthe active region 120.

Referring to FIG. 24 to FIG. 26, a plurality of second trenches T2 isformed by etching the active pillars 120 in a second direction cross tothe bit lines 130 to a depth corresponding to the upper surface of thefirst impurity region 120 a.

By way of example, when the substrate 110 is a silicon substrate,etching for forming the second trenches T2 may be performed by a dryetching process using chlorine (Cl₂) gas, HBr gas, or a mixture ofchlorine (Cl₂) gas and HBr gas

Referring to FIG. 27 to FIG. 29, a gate insulation layer 150 is formedover sidewalls of the second and third impurity regions 120 b, 120 c andover the bottom surfaces of the second trenches T2. The gate insulationlayer 150 is arranged in the second direction cross to the bit lines130.

The gate insulation layer 150 may be embodied by a silicon oxide layer(SiO₂), which is formed by radical oxidation and then subjected to aselective etching process. Alternatively, the gate insulation layer 150can be formed of a high dielectric (high-k) layer by (i) depositing ahigh dielectric material having a higher dielectric constant than thesilicon oxide layer SiO₂ to form a high dielectric material layerthrough CVD, and then (ii) performing a selective etching process to thedielectric material layer.

Particularly, when using radical oxidation or CVD, the insulation layermay be formed thicker at a bottom surface of the second trenches T2 thanover a sidewall of the active region 120. Accordingly, the gateinsulation layer 150 has a horizontal insulation section 150 b, which isformed at the bottom surface of the second trench T2 and extendsperpendicular to a vertical insulation section 150 a, thicker than avertical insulation section 150 a, which is formed over the sidewall ofthe second and the third impurity regions 120 b, 120 c.

Then, gate electrodes 160 are formed over two sidewalls of the secondimpurity region 120 b having the gate insulation layer 150 therebetween. The gate electrodes 160 each provided over two sidewalls of thesecond impurity region 120 b collectively form of a dual gate.

The gate electrodes 160 may be formed of an electrically conductivematerial, for example, a metallic material having the same work function(about 5.25eV) as p+-implanted polysilicon. By way of example, the gateelectrodes 160 may be formed of molybdenum (Mo), nickel (Ni), platinum(Pt), ruthenium oxide (RuO₂), and the like. Specifically, a metal layerfills a gap between adjacent active regions 120 formed over the gateinsulation layer 150, and is then subjected to CMP until an uppersurface of the active region 120 is exposed. Then, a selective etchingprocess is performed on the metal layer until the top surface of themetal layer is level with the interface between the second and the thirdimpurity regions 120 b, 120 c.

The exposed metal layer is further etched using a gate spacer etch-backprocess to obtain the electrodes 160. Specifically, a dielectric layeris formed over the selectively etched metal layer, and patterned to forma spacer. The metal layer is subjected to the etch-back processing usingthe spacer thereby forming the gate electrodes 160. At this time, thegate electrodes 160 extend in the second direction cross to the bitlines 130, thereby forming word lines.

Although not shown in the drawings, some of the dielectric layers mayremain over the gate electrodes 160 when the gate spacer etch-backprocess was completed, and act as insulation layers.

Further, the gate electrodes 160 may be formed as a single gate insteadof the dual gate. In a single gate configuration, the gate electrode 160is formed over one sidewall of the second impurity region 120 b, ratherthan two sidewalls. Alternatively, the gate electrode 160 may be formedas a surrounding gate which surrounds the sidewalls of the secondimpurity region 120 b.

Referring to FIG. 30 to FIG. 32, a third isolation layer 170 is formedbetween the gate electrodes 160 such that the second trench T2 (see FIG.25) above the gate electrodes 160 is filled with the third isolationlayer 170.

The third isolation layer 170 may be formed by depositing a siliconoxide layer, a silicon nitride layer, a BPSG layer, a PSG layer, a SOGlayer, a PSZ layer, an O₃-TEOS layer, a HDP oxide layer, an ALD oxidelayer or the like via CVD, ALD, or another gap-filling process(see FIG.25), and then subject to a CMP or etch-back process until the uppersurface of the active region 120 is exposed. In this way, the thirdisolation layer becomes planarization with the upper surface of theactive region 120.

As a result, adjacent active pillars 120 are isolated from each other bythe first, second, and third isolation layers 125, 140, 170.

FIG. 33 is a sectional view of the semiconductor device of FIG. 31,which has a storage node contact plug and a capacitor formed on theactive region.

Referring to FIG. 33, after forming the third isolation layer 170 ofFIG. 31, a capacitor 190 is formed to be electrically connected to thethird impurity region 120 c through a storage node contact plug 180,which fills a contact hole CH in an interlayer insulation layer 175formed over the active region, thereby forming a DRAM with a 4F² layout.

The capacitor 190 may include a capacitor lower electrode 191, adielectric layer 193, and a capacitor upper electrode 195. The capacitor190 has a cylinder structure. Since the interlayer insulation layer 175,the contact hole CH, the storage node contact plug 180, and capacitor190 may be formed using a process well-known to a person having anordinary skill in the art, detailed descriptions thereof will be omittedherein.

Meanwhile, although impurity implantation is described as beingperformed after the bit lines 130 are formed, the impurity implantationmay be performed in other ways. For example, in an embodiment describedhereinafter, the impurity implantation is performed before the bit lines130 are formed.

FIGS. 34 and 35 are sectional views of a method of manufacturing asemiconductor device via impurity implantation according to anotherembodiment.

Referring to FIG. 34, after forming the plurality of pillars P separatedfrom each other by the first trenches Ti of FIG. 14, an impurity isimplanted into the pillars P to form active pillars 120, each of whichincludes first, second, and third impurity regions 120 a, 120 b, 120 chaving substantially the same concentration of the impurity of the samepolarity from a lower portion to the top of each pillar P.

Herein, although the active pillars 120 are illustrated as including thefirst to third impurity regions 120 a 120 b, 120 c formed throughimpurity implantation, the first to third impurity regions 120 a, 120 b,120 c of the active pillars 120 may be defined by a position of the gateelectrode which is formed in a subsequent process.

Impurity implantation conditions for forming the active pillars 120 maybe the same as that of the embodiment described above, and thus adetailed description thereon will be omitted.

Referring to FIG. 35, the first isolation layer 125 is formed over abottom surface of the first trench T1 (see FIG. 14) and a lower sidewallof the first trench T1 (see FIG. 14), and the bit line 130 fills a gapbetween the first insulation layer 125 and a lower sidewall of thepillar P (see FIG. 14). Since the material and the process for formingthe bit line 130 and the first isolation layer 125 may be the same asthose of FIG. 15 to FIG. 17, repeated descriptions thereof will beomitted.

In this embodiment, in order to ensure uniform distribution of theimplanted impurity within the active region 120, the method may furtherinclude annealing at 900 to 1100 Celsius degrees, for example, using arapid thermal annealing (RTA) process.

As such, when the bit lines 130 are formed after the active pillars 120are formed through impurity implantation, the method is moreadvantageous to obtain a more uniform doping profile in the activepillars 120.

FIGS. 36 and 37 are sectional views of a method of manufacturing asemiconductor device via impurity implantation according to a furtherembodiment.

Referring to FIG. 36, an impurity is implanted throughout the substrate110 to a depth corresponding to a bottom of an active pillar. Theimpurity may be implanted into the substrate by ion implantation. As aresult, one region of the substrate 110 is formed with pre-activepillars 120A. Such an impurity implantation process may be carried outby typical ion implantation and a doping concentration of impurity iscontrolled to be 8×10¹⁸ to 3×10¹⁹ atom/cm³. In addition, such ionimplantation may be carried out in combination of multi ionimplantation, tilt ion implantation, and orient ion implantation. Duringthe implantation process, the substrate 110 can be rotated or moved infront, rear, right, and left directions.

Referring to FIG. 37, a plurality of active pillars 120 are formed byetching the substrate 110 in a first direction (for example, in adirection cross to the word lines) to form a plurality of trenches usingphotolithography (see FIG. 36).

Here, each of the active pillars 120 vertically protrudes from thesubstrate 110 and includes a first impurity region 120 a, a secondimpurity region 120 b and a third impurity region 120 c, which aresequentially formed from lower portions of the active pillars 120. Thefirst to third impurity regions 120 a 120 b, 120 c of the active pillars120 may be determined according to positions of gate electrodes, whichwill be formed in a subsequent process.

Except for formation of the active pillars 120 by etching the substrateafter the impurities are implanted throughout the substrate 110, themethod according to this embodiment employs the same processes as thoseof the embodiment described with reference to FIGS. 12 to 32, and thusdetailed descriptions thereof will be omitted herein.

As such, when the bit lines 130 are formed after forming the activepillars 120 separated by the trenches by etching the substrate 110, themethod advantageously provides, in addition to the advantages obtainablefrom the embodiment described above, a more uniform doping profile inthe active pillars 120.

In addition, although not shown in the drawings, when the bit lines 130are formed under the first impurity regions 120 a as shown in FIG. 11.To form such device shown in FIG. 11, the active pillars 120 eachincluding the first to the third impurity regions 120 a, 120 b, 120 cmay be formed by forming a plurality of recesses in the substrate 110. Aliner insulation layer 172 is formed over bottom surfaces of therecesses and sidewalls of the recesses. Buried bit lines 130 are formedover the liner insulation layer 172 using a conductive material such asmetal, metal silicide, polysilicon, and the like. Ion implantation ofthe same kind of impurity is performed into semiconductor pillars.Bottom surfaces of the pillars are contacting the bit lines, and uppersurfaces and sidewalls of the pillars are exposed to the outside.

The active pillars 120 may be formed by stacking a semiconductorsubstrate including first to third region layers over the substrate 110or forming semiconductor growth layers over the substrate 110. Then,impurities of the same polarity are implanted into the respective regionlayers. Next, the semiconductor substrate 110 is removed from theimplanted stack layer or the implanted semiconductor growth layers. Sucha method of forming the active pillars 120 may also be applied to thesemiconductor devices shown in FIGS. 1 and 7 and the semiconductordevice including the surrounding gate. In this case, the process ofremoving the implanted stack layers or the semiconductor growth layersimplanted with the impurity from the substrate 110 may be substitutedwith a process of patterning the semiconductor substrate orsemiconductor growth layers (or implanted stack layers) implanted withthe impurity.

Further, in FIG. 11, the bit lines 130 may be formed by ion implantationof impurities into the substrate 110. In this case, the bit lines 130may be formed by ion implantation of an impurity, which has a differentpolarity than that of the substrate 110. Alternatively, the bit lines130 may be formed by forming an insulation layer through implantation ofnitrogen into the substrate 110, followed by implanting an impurity intothe insulation layer. The other processes for forming gate electrodes orimpurity implantation are the same as those described above, anddetailed descriptions thereof will be omitted.

Next, voltage-current characteristics of a DRAM and charge and dischargecharacteristics according to an embodiment of the present invention willbe described.

FIG. 38 shows a simulation result of a drain current with respect to agate voltage the DRAM according to the first embodiment of the presentinvention shown in FIG. 1, in which simulation was carried out using aTCAD tool Sentaurus (Synopy Co., Ltd.). The simulation result shown inFIG. 38 was obtained under the following conditions. Impurity dopingconcentration in the active region 120 was 1×1019 atom/cm3. See FIGS. 1and 5. The silicon thickness in the active region 120 was 10 nm. SeeFIGS. 1 and 6. The thickness of the gate insulation layer 150 a was 2nm. See FIGS. 1 and 8. Drain voltage was 1 V. The dual-gate electrodesare each formed of molybdenum (Mo).

As shown in FIG. 38, it could be ascertained that a threshold voltagewas −0.2V and there was a sufficient difference between off-current andon-current.

Based upon this result, it could be ascertained that the junctionlessvertical gate transistor may work as a DRAM cell since the junctionlessvertical gate transistor shows similar on/off characteristics to thoseof a conventional transistor in which source and drain regions areimplanted with different kind of impurities from that of a body region.

A simulation result of charge and discharge characteristics of the DRAMaccording to the first embodiment of the present invention is shown inFIG. 39. The simulation was carried out using a TCAD tool Sentaurus(Synopy Co., Ltd.) and transient time was 10 ns. The simulation resultwas obtained under the same condition as employed for the simulationshown in FIG. 38. As shown in FIG. 39, it could be ascertained thatelectric charges were stored (charged) and discharged in a capacitorconnected to the source of the DRAM according to the first embodiment ofthe present invention.

FIG. 40 is a graph depicting (i) an energy band of a DRAM according tothe first embodiment of the present invention and (ii) that of aconventional DRAM including source/drain regions which are formedthrough implantation of impurities different from the impurities in abody region. The conventional DRAM includes an inversion mode verticalgate transistor. These simulation results were obtained under the samecondition as employed for the simulation shown in FIG. 38.

Referring to FIG. 40, it can be ascertained that the source, the body,and the drain regions of the DRAM have lower energy barriers thansource, body, and drain regions of the conventional DRAM, respectively.

As a result, it can be ascertained that the DRAM including thejunctionless vertical gate transistor according to an embodiment of thepresent invention has improved current leakage characteristics comparedwith a conventional DRAM including a junction vertical gate transistor.

Although some embodiments have been described herein, it should beunderstood by those skilled in the art that these embodiments are givenby way of illustration only, and that various modifications, variations,and alterations can be made without departing from the spirit and scopeof the invention. Therefore, the scope of the invention should belimited only by the accompanying claims and equivalents thereof.

What is claimed is:
 1. A semiconductor device comprising: an activepillar vertically protruding from a substrate and including a firstimpurity region, a second impurity region over the first impurityregion, and a third impurity region over the second impurity regionformed ; a gate electrode formed over a sidewall of the second impurityregion; and a bit line arranged in a cross direction from the gateelectrode and contacted to the first impurity region, wherein the first,second, and third impurity regions comprise impurities of the samepolarity.
 2. The semiconductor device according to claim 1, wherein eachof the first, second, and third impurity regions has an impurityconcentration ranging from 8×1018 to 3×1019 atom/cm3.
 3. Thesemiconductor device according to claim 1, wherein the first, second,and third impurity regions have substantially the same impurityconcentration.
 4. The semiconductor device according to claim 1, whereinthe first impurity region is a drain region, the second impurity regionis a body region, and the third impurity region is a source region. 5.The semiconductor device according to claim 1, wherein the gateelectrode surrounds the sidewall of the second impurity region.
 6. Thesemiconductor device according to claim 1, wherein the bit line iscontact a sidewall of the first impurity region and is formed over thesubstrate.
 7. The semiconductor device according to claim 1, wherein thebit line is formed in the substrate and under the first impurity region,wherein the bit line is contacted to a bottom of the first impurityregion.
 8. The semiconductor device according to claim 7, the devicefurther comprising: an insulation layer formed between the substrate andthe bit line.
 9. The semiconductor device according to claim 1, whereinthe substrate is a silicon (Si) substrate, and the active pillarcomprises an N-type impurity.
 10. The semiconductor device according toclaim 1, wherein the substrate is any of a Si—Ge substrate, a Gesubstrate, a III-V group compound semiconductor substrate and acombination thereof, and the active pillar comprises a P-type impurity.11. The semiconductor device according to claim 1, wherein the substratehas a nano structure, wherein the nano structure includes any of a nanowire structure, a nano ribbon structure, and a combination thereof. 12.The semiconductor device according to claim 1, the device furthercomprising: a gate insulation layer, wherein the gate insulation layercomprises: a vertical insulation section formed between the gateelectrodes and the second impurity region, and a horizontal insulationsection contacted to a lower portion of the vertical insulation sectionand formed between the first impurity region and the gate electrodes,wherein the horizontal insulation section is thicker than the verticalinsulation section.
 13. A method of manufacturing a semiconductordevice, comprising: forming a plurality of active pillars, each having afirst impurity region formed over a substrate and second and thirdimpurity regions sequentially formed on the first impurity region;forming a bit line between adjacent active pillars and over thesubstrate to be insulated from the substrate and contacting to a firstsidewall of the first impurity region; and forming a gate electrode overa sidewall of the second impurity region in a direction of intersectingwith the bit line.
 14. The method according to claim 13, wherein formingthe gate electrode comprises: forming an insulation layer over the bitline; patterning the insulation layer and the plurality of activepillars to form a plurality of trenches, each of the trenches extendingin a cross direction from the bit line; forming a gate insulation layerover a bottom surface and a sidewall of the trench; and forming the gateelectrode with a conductive material over the gate insulation layer tobe disposed over the sidewall of the second impurity region.
 15. Themethod according to claim 13, wherein the step of forming the pluralityof active pillars comprises: activating the first impurity region; andactivating the second impurity region and the third impurity region,wherein the first, second, and third impurity regions are performedusing an in-situ process.
 16. The method according to claim 13, whereinthe step of forming the plurality of active pillars comprises: forming asemiconductor growth layer including first, second, and third regionlayers over the substrate; implanting impurities with substantially thesame polarity into the first, second, and third region layers of thesemiconductor growth layer; and patterning the impurity-implantedsemiconductor growth layer to form the plurality of active pillars. 17.The method according to claim 13, wherein forming the plurality ofactive pillars comprises: stacking a semiconductor substrate includingfirst, second, and third impurity regions over the substrate; andpatterning the semiconductor substrate to form the plurality of activepillars.
 18. The method according to claim 13, wherein the first,second, and to third impurity regions have substantially the sameimpurity concentration.
 19. The method according to claim 13, whereinthe plurality of active pillars are formed by using any of multi ionimplantation, tilt ion implantation, and orient ion implantation. 20.The method according to claim 13, wherein forming the bit linecomprises: forming an insulation layer over a second sidewall of thefirst impurity region and over the substrate between adjacent activepillars; and forming a conductive material layer over the insulationlayer to obtain the bit line.